INDIUM 6.2, Water Soluble Solder Paste

INDIUM 6.2, Water Soluble Solder Paste View Large Image
6.2

Newer generation material designed to maximize production yields by minimizing printing & reflow related defects. Indium6.2 can be used with Sn63 & Sn62 eutectic alloys. Exceptional Printing, Unprecedented Stencil Life, Wide Humidity Tolerance, Extraordinary Tack Time and Strength, wide reflow process window,Excellent,Wetting Capabability,Superior Fine Pitch Soldering Ability,Ultra-Low Voiding,Halide-Free.

Benefits

• Exceptional Printing

• Unprecedented Stencil Life

• Wide Humidity Tolerance

• Extraordinary Tack Time and Strength

• Wide Reflow Profile Window

• Excellent Wetting Capability

• Superior Fine Pitch Soldering Ability

• Ultra-Low Voiding

• Halide-Free

Alloys

Indium Corporation manufactures low oxide spherical powder composed of eutectic Sn/Pb and Sn/Pb/Ag in the industry standard type 3 mesh size (J-STD-006).

Other non-standard mesh sizes are available upon request. The weight ratio of the flux/vehicle to the solder powder is referred to as the metal load and is typically in the range of 80-92% for standard alloy compositions.

Stencil Design:

The sharp, brick shaped print definition of Indium6.2 enables the process of fi ne pitch applications. The unprecedented stencil life of this product virtually eliminates waste of solder paste. Furthermore, the outstanding humidity tolerance of this product allows consistent printing performance from 20% to greater than 70% R.H., even after 16 hours idle time. After 48 hours exposure at 70% R.H., no slump can be detected, thus assures satisfactory performance for fine pitch applications under a wide range of humidity

 

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