INDIUM Heatspring Thermal Compound Substitute

INDIUM Heatspring Thermal Compound Substitute View Large Image
Heatspring

Many applications call for TIM that can easily be placed on a chip, on a lid or perhaps just against a heat source and a cooling solution contact plate. We developed a metal TIM which would work as a compressible Interface Solution for such an application. Our pressure range is 35psi to 100+ psi.

An SMA-TIM made of indium offers uniform thermal resistance at lower applied stresses in compressed interfaces. The malleability of indium minimizes surface resistance and increases heat flow. Our patented Heat-Spring® technology will further reduce the thermal resistance.

Indium's line of high-end thermal interface materials delivers superior performance over time. As SMA-TIM products are made of metal, they cannot experience pump out problems even under power cycling. The Heat-Spring® material, which does not contain silicone, will conform to surface disparities over time, thereby reducing thermal resistance through the life of the TIM. Due to its solid state, the SMA-TIM also resists bake out.

Thermal interface materials are useful for a variety of applications, but solder thermal interface materials (sTIM) are especially suited to high-end device cooling. To improve package reliability, it is especially important to choose the right alloy. Indium, in particular, should be considered as a sTIM because of its high thermal conductivity, compressibility (SMA-TIM), and ease of application.

Applications

Indium Preforms may be used in a variety of processes.

• Compressed Between Two Surfaces Without Reflow: (SMA-TIM) Soft Metal Alloy-TIM/. The extreme malleability of indium allows it to minimize surface resistance – thereby increasing heat flow. The graph below demonstrates this phenomenon.

• Soldered Between Two Surfaces: (sTIM) Solder-TIM. Used to further improve thermal resistance, this application may require the use of a flux to reduce oxides on soldering surfaces.

• Cold-Welding: Another process that is used to create a thermal interface involves reflowing indium preforms onto each solderable surface. The indium-coated surfaces should be cleaned and pressed together to form a fluxless cold-weld solder joint. (See the Application Note: Etching Indium to Remove Oxides for more information about this process.)

Clear All

Your Recently Viewed Products

Oops! Something went wrong there and we were unable to load the page you requested.

Sign Up