INDIUM SMQ 92J, No-Clean Solder Paste SnPb


INDIUM SMQ 92J, No-Clean Solder Paste SnPb View Large Image

As a leader in soldering technology, Indium Corporation offers a number of solder pastes for SnPb circuit board assembly. With proven flux technology, these solder pastes will provide the highest end of line yields.


NC-SMQ® 92J-UV is a halide-free, air reflow, no-clean solder paste formulated to leave a UV Fluorescing, probe-testable residue. The post reflow flux residue contains a UV tracer that allows instant identification of any extraneous flux residues when inspected under a UV light. This is especially useful in applications where gold fingers or contacts, such as memory modules, are used.

This product has other qualities such as consistent fine pitch paste deposition, unsurpassed stencil life and tack time, and excellent wetting. NC-SMQ92J-UV will perform well on high speed surface mount lines utilizing fast print speeds and rapid chip placement. NC-SMQ92J-UV meets or surpasses all ANSI/J-STD-004, -005 specifications and Bellcore test criteria

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INDIUM SMQ 92J, No-Clean Solder Paste SnPb €0.00


• Excellent wetting reflow in air

• Probe-testable UV fluorescing, post reflow residue

• Extended open time

• Consistent fine-pitch printing

• Strong initial tack strength and long-term stability

• High humidity resistance

• Halide-free


Indium Corporation manufactures low-oxide spherical powder composed of Sn-Pb and Sn-Pb-Ag in the industry standard type 3 mesh size. Other, non-standard, mesh sizes are available upon request. The weight ratio of the flux/vehicle to the solder powder is referred to as the metal load and is typically in the range of 85-92% for standard alloy compositions.

Stencil Design:

Electroformed and laser cut/electropolished stencils produce the best printing characteristics among stencil types. Stencil aperture design is a crucial step in optimizing the print process. The following are a few general recommendations:

• Discrete components — A 10-20% reduction of stencil aperture has significantly reduced or eliminated the occurrence of mid-chip solder beads.

The “home plate” design is a common method for achieving this reduction.

• Fine pitch components — A surface area reduction is recommended for apertures of 20 mil pitch and finer. This reduction will help minimize solder balling and bridging that can lead to electrical shorts. The amount of reduction necessary is process dependent (5-15% is common).

• For adequate release of solder paste from stencil apertures, a minimum aspect ratio of 1.5 is suggested. The aspect ratio is defined as the width of the aperture divided by the thickness of the stencil.

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