INDIUM CORPORATION Indium 10.1 Pb-Free Solder Paste

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Code 10.1
  • Low voiding on QFN, BGA, and CSP components
  • Exceptional head-in-pillow resistance 
  • High transfer efficiency and low variation through small apertures (≤0.66 AR)
  • Eliminates the graping phenomenon
  • Outstanding RF shield metallization wetting
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Features

  • Excellent NWO performance
  • Very wide reflow profile window under both air and nitrogen
  • Excellent HIP performance
  • Excellent soldering performance and process yield
  • Excellent wetting to all fresh and aged surface finishes, including, but not limited to:
  1. OSP
  2. Immersion Ag
  3. Immersion Sn
  4. ENIG
  • Low bridging, tombstoning, and solder beading
  • Low voiding in all joints including QFN and BGA assemblies
  • Clear post reflow residue
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