INDIUM Tacflux 89HF, Halogen Free Rework & Repair Tacky Flux

INDIUM Tacflux 89HF, Halogen Free Rework & Repair Tacky Flux View Large Image
Tacflux 89HF

Indium8.9 is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag, and other alloy systems favored by the electronics industry to replace conventional Pb- bearing solders. Indium 8.9 offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. In addition, the high probe testability of Indium 8.9 minimizes false failures in ICT.

TACFlux® 089HF is a no-clean flux formulated for Sn/Ag/Cu and Sn/Ag solders (also compatible with Sn/Pb solder). TACFlux® 089HF provides excellent wetting in air or nitrogen atmospheres. The flux and flux residue is halogen-free.

 

Features

  • High transfer efficiency through small apertures
  • Excellent wetting to all common finishes
  • Clear, probe testable flux residue
  • Eliminates head-in-pillow defects

Compatible Products

  • Rework Flux: TACFlux® 020B and 089
  • Cored Wire: CW-501, CW-801
  • Wave Flux: WF-7742, WF-9942

Packaging: TACFlux® 089HF is available in 10cc and 30cc syringes or 100g jars, however other packaging can be provided to meet specific requirements.

Cleaning: TACFlux® 089HF is designed for no-clean applications. If necessary, the flux can be removed by using a commercially available flux cleaner.

Reflow: Peak reflow temperature should be <260°C in an air or nitrogen atmosphere.

Storage: TACFlux® 089HF syringes and cartridges should be stored tip down at 0-30°C. If refrigerated, TACFlux® 089HF should be thawed for 4 hours at room temperature before using.

Oops! Something went wrong there and we were unable to load the page you requested.

Sign Up