METCAL APR-1200A-SRS-MOB Scorpion Rework System

METCAL APR-1200A-SRS-MOB Scorpion Rework System View Large Image
APR-1200A-SRS-MOB

 

METCAL APR-1200A-SRS-MOB Scorpion Rework System 

The Scorpion Advanced Package Rework System ensures both accurate component placement and custom tailored reflow profiles in one user friendly, single platform rework system. The Scorpion System redefines precision and addresses the technical demands presented by component manufacturers today.

The challenges of array package rework, and the inability to easily inspect placement accuracy, call for a solution that allows for simultaneous viewing of Printed Circuit Board pads and component balls for accurate placement.

The Scorpion Rework System fills this need with quick,accurate placement through the use of an all new vision system employing dual image overlay technology. This new vision system features LED lighting both top and bottom for shadow-free component visualization and component alignment. The HD camera is ready to go out of the box.

The two-head modular design allows the Scorpion ReworkSystem to be tailored to the users specific rework needs and allows precision alignment of the smallest BGAs, QFNs and Micro SMDs with the highest accuracy. The open-ended board holder fits a wide variety of large, small and odd-shaped boards while allowing precise positioning over the patented dual subzone preheater.

The standard auto-profile mode ensures fast and easy profile creation with a minimum of setup time. By selecting your temperature targets any operator can quickly and accurately create reflow profiles for a wide variety of boards, and then save them in memory for future use.

Source temperatures and time intervals can be modified and added “On-the-Fly"eliminating the need to wait for the current profile to terminate before modifications can be made. The profiles can range from a simple four zones to a complex reflow oven style profile. Precise solder joint temperatures are measured and displayed on a real time graphical display, thus providing the necessary data to accurately and easily establish the optimum reflow profile for each particular application within minutes. 

The modular design of the Scorpion Rework System allows it to be configured to the users’ specific needs. The two-head systems,APR-1200-SRS, APR-1200A-SRS & APR-1200A-SRS-MOB, feature placement accuracy to 0.0015" (.038mm).The standard single-head system,APR-1100-SRS, provides placement accuracy to0.004" (.1mm).

The Scorpion system accepts the full range of APR and QX series reflow nozzles. Flux transfer plates and solder paste plates are available to ensure repeatable process control during the replacement operation.

Features:

  • Motorized Final Placement: Final placement module capable of 50mm of motorized travel in the Z-axis and a full 360° in ? (Theta).
  • Force FeedbackControl: Enables the unit to accurately pick and place components without disturbing the component or solder.
  • Component Alignment: Fine motor control of .005”/.127mm in the Z-axis & 0.25° ?during alignment of the component to the pad.
  • Redesigned Remote Control: The new remote control incorporates the controls for the placement module and adds new digital controls for the top & bottom LED lighting of the camera module
  • SmartPlaceTechnology Vision System for Mobile Products: a 1080p, high definition, camerasystem that enables the operator to align and position components accuratelybefore placement. Ideal for use with the smaller packages commonly used inmobile devices up to 25mm x 25mm

Hardware Features:

  • Desktop sized
  • 2800W dualzone preheater with 550W top heater
  • 208-240VAC,50/60Hz, 15A-13A, Single Phase
  • Modular design allowing the customer to customize the unit to meet their needs
  • A 343mm(13.5") x open-ended PCB holder with micrometer adjustment
  • Mechanical X and Z axis movement on linear bearings for long-life and minimal maintenance
  • Component is retracted automatically at the end of reflow when removing parts
  • Linux-based integral computer
  • External USB for file transfer
  • SmartPlace Vision System is a high definition vision system which uses dual CMOS sensors to assist in the placement of  components and requires no calibration.
Specifications:
  • Input Voltage: 208-240VAC, 50/60Hz, 15 Amp Single Phase
  • System Total: 2800W (average power)
  • Inner Zone: 900W (heater rating)
  • Outer Zone: 1800W (heater rating)
  • Reflow Heater: 550W (heater rating)
  • Operating Temperature: 41°F (5°C) to 104°F (40°C)
  • Maximum Relative humidity: 80% at 88°F (31°C) decreasing linearly to 50% at 104°F (40°C)
  • Maximum Altitude: 6500 ft. (2km)
  • Pollution Degree: 2 per IEC 644
  • Insulation category: II
  • Temperature Control Type: Closed-Loop Control (Thermocouple)
  • Reflow Head: 400°C (752°F)
  • Pre-Heater (Inner/Outer): 350°C (662°F)
  • Supply: 24V DC Blower
  • Maximum Field of View: 1.77" x 1.77" (45mm x 45mm)
  • Minimum Size: 0.020" x 0.010" (0.51mm x 0.25mm)
  • Maximum Weight: 1.94 oz. (55 g)
  • PCB Handling Capability: 13.5" x open (342.9 mm x open)
  • Maximum Size: 12" x open (304.8 mm x open) for APR-1200A-SRS-MOB only
  • Maximum Thickness: 0.25" (6mm)
  • System Dimensions W x D x H: 18" x 22" x 26" (457mm x 559mm x 660mm)
  • Weight: 140lbs (63.5kg)
  • System Warranty: One-year parts & labour 90 days heaters & lamps
  • Input Voltage: 208-240VAC, 50/60Hz, 15 Amp Single Phase
  • System Total: 2800W (average power)
  • Inner Zone: 900W (heater rating)
  • Outer Zone: 1800W (heater rating)
  • Reflow Heater: 550W (heater rating)
  • Operating Temperature: 41°F (5°C) to 104°F (40°C)
  • Maximum Relative humidity: 80% at 88°F (31°C) decreasing linearly to 50% at 104°F (40°C)
  • Maximum Altitude: 6500 ft. (2km)
  • Pollution Degree: 2 per IEC 644
  • Insulation category: II
  • Temperature Control Type: Closed-Loop Control (Thermocouple)
  • Reflow Head: 400°C (752°F)
  • Pre-Heater (Inner/Outer): 350°C (662°F)
  • Control: Low, Medium, & High
  • Supply: 24V DC Blower
  • Maximum Field of View: 1.77" x 1.77" (45mm x 45mm)
  • Minimum Size: 0.020" x 0.010" (0.51mm x 0.25mm)
  • Maximum Weight: 1.94 oz. (55 g)
  • PCB Handling Capability: 13.5" x open (342.9 mm x open)
  • Maximum Size: 12" x open (304.8 mm x open) for APR-1200A-SRS-MOB only
  • Maximum Thickness: 0.25" (6mm)
  • System Dimensions W x D x H: 18" x 22" x 26" (457mm x 559mm x 660mm)
  • Weight: 140lbs (63.5kg)

 

 

 

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