The Nikon Metrology XT V130 X-ray Inspection System is a high-precision, flexible solution that facilitates defect analysis in loaded PCB boards. Designed for 100% BGA and μBGA inspection, multi-layer board inspection and PCB solder joint inspection, it is a compact, easy-to-use, and most of all, cost-effective inspection system that is an indispensable workhorse in any electronics production area.
Intuitive to use
Focus on productivity
Safety as a design criterion
Low cost of ownership