NIKON METROLOGY XTV 160, Micro Focus X-Ray Inspection

NIKON METROLOGY XTV 160, Micro Focus X-Ray Inspection View Large Image
XTV 160

The XTV-160, also known as the Revolution, has been developed utilizing NIKONS 20 years experience in nanofocus X-ray technology. The system provides the highest resolution and magnification possible within a compact system and is ideally suited for inspection of electronic components in production lines and failure analysis laboratories. The XT V 160 is a versatile tool that allows an operator to easily make use of the system’s manual and programmable inspection capabilities.

On top of it is ready for Computed Tomography CT inspection to reconstruct the test sample in full 3D image.Designed for 100% BGA and µBGA inspection, multilayer board inspection and PCB solder joint inspection, it is a simple to use, high resolution and cost-effective inspection solution that is an indispensable workhorse for any inspection lab.

Maximum magnification - 6000x

  • The transmission target design fitted to the XT V160’s X-ray source has an ultra thin output window that enables samples to be safely placed within 250 microns of the focal spot providing up to 6000x system magnification.

High resolution - Micron level features

  • A tightly controlled nanofocus X-ray spot and the latest digital imaging technology ensure that the XT V 160 produces sharp images of micron level features even in the most challenging samples. The advanced electromagnetic lens is computer controlled to ensure that the image remains in focus at all kV settings and the target does not burn when using high power.

High penetration - 160kV

  • The patented Nikon Xi "Open Tube" X-ray source is smaller than any other design and allows X-ray images of fine detail in thick and dense samples to be seen with ease. This high energy vacuum de-mountable unit allows views at steep angles through solder joints and heatsinks without ever running out of energy.

True concentric imaging

  • The operator chooses a region of interest (ROI) to inspect and positions it in the centre of the screen. Under any combination of rotate, tilt and magnification, the ROI remains completely locked into the center of the field of view.
  • The true concentric imaging feature operates over the entire scan area of the manipulator. The ROI stays locked in, regardless of the sample’s position on the manipulator table, ideal for inspecting around single or multiple BGA balls.

True parallel tracking for BGA applications

  • A combination of tilt and rotate is required to give the best unobstructed view of BGA balls. The next step is to scan along the rows to inspect for failures. With standard manipulators, this necessitates the simultaneous operation of 3 axes - requiring considerable skill on behalf of the operator.
  • Nikon’s true parallel tracking maintains the X and Y axes parallel to the BGA, allowing the rows to be scanned using a single X or Y axis. This feature is enabled as part of the advanced system control concept.

Advanced ergonomics

  • The XT V 160 has been designed for ease-of-use without compromising performance.
  • Fully adjustable shelves ensure that all system controls are at the operator’s fingertips whether standing or sitting, independent of the person’s height.
  • The Windows control screen is laid out logically with all regularly used functions in view on single click buttons while movement of the precision joysticks gives a direct and logical response from both sample manipulator and X-ray image.
  • The system is highly intuitive to operate and as a result, operator training time is significantly reduced.

Integrated Inspect-X Software

  • The XT V 160 incorporates the most advanced image capture and analysis software. It runs under Windows XP on the latest specification processing hardware. The resulting data can be saved or exported directly any COM compliant package eg MS Word, Excel, Access and SPC systems . Photo quality printouts can be made on a range of inkjet, laser or thermal printers.
  • Processing hardware and software are both controlled in-house so that advances in technology can be passed on to the user without delay.Inspect-X includes special functions for inspection of semiconductor package voids, wire bonding and BGA solder bumps. It also makes use of Microsoft VBA as a scripting/macro language, allowing rapid software customisation to suit specific inspection requirements.

Footprint efficient

  • The Xi source releases more of the XT V160’s volume for sample manipulation, providing a generous 400x400mm (16”x16”) scan area in a system with a footprint of only two square metres.

Low cost of ownership

  • Nikon’s open X-ray tube development has driven down the size, weight and cost of the system whilst maintaining superior quality and performance. By introducing a patented zero-maintenance cable-less HT generator, the preventative maintenance has been dramatically reduced making the long term cost of ownership considerably lower than any comparable system.

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