INDIUM High-Temperature Gold Solder & Braze Materials

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GOLD

Indium Corporation is a leading joining and bonding materials innovator for medical, aerospace, optoelectronics, and automotive applications. When even 10 ppm of contamination can cause process and application failures – quality counts. Indium Corporation casts our alloys, which enables us to closely control the process from start to finish and ensure purity.

 

High-Temperature Solder and Braze Materials Deliver:

  • Highest tensile strength of any solder
  • High melting point is compatible with subsequent reflow processes
  • Pb-free and RoHS compliant
  • Superior thermal conductivity
  • Resistance to corrosion
  • Superior thermal fatigue resistance
  • Good joint strength
  • Excellent wetting properties
  • Resistance to oxidation

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INDIUM High-Temperature Gold Solder & Braze Materials €0.00

Gold-tin (AuSn) Solders

  • Die-Attach: Thermal requirements often mandate a high-melting die-attach solder. With a melting point of 280°C, eutectic AuSn often satisfies these demands.
  • Hi-Reliability Applications: AuSn is compatible with gold metallizations. Coupled with its long-term reliability, AuSn is a good choice for high-reliability applications such as microwave systems, medical and aerospace applications, and more.
  • Lid Sealing: AuSn has excellent wetting properties. Its relatively low melting point (when compared to certain die-attach alloys) and its long-term reliability makes AuSn popular for lid sealing applications.
  • Braze Alternative: Eutectic AuSn, with a tensile strength of 275 MPa (40,000 pounds/square inch), provides a great alternative to brazes when high strength must be achieved at soldering temperatures.

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INDIUM High-Temperature Gold Solder & Braze Materials

INDIUM High-Temperature Gold Solder & Braze Materials

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