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InTEGRATED® Solder Preforms are joined in a matrix by fine, precise strands of solder which, during the soldering process, melt and flow to adjacent pads to give you complete preform separation.
InTEGRATED® Solder Preforms save assembly time and labor costs by allowing simultaneous placement of all the solder preforms needed on connector pins, Pin Grid Arrays (PGAs) and other multiple-pad/pin components. They solve both assembly and product design challenges by allowing users to specify fabrications in the most complex arrays, including those which would be impossible or cost-prohibitive to produce by conventional methods. Arrays can even be designed with built-in frames to improve handling in manual assembly processes.
InTEGRATED® Solder Preforms can also be used in non-array configurations for applications such as vacuum, cryogenic sealing, and other mechanical assembly operations
Pure indium, tin, lead and silver, or any combination thereof, can be made into InTEGRATED® Solder Preform. Upon request, other metals and alloys will be evaluated for their applicability to InTEGRATED® Solder Preform technology.
Center to center accuracy can be held to +/-.0002".
Because specification limitations vary by alloy, preform thickness and shape, and other considerations, please consult with our sales or technical staff for recommendations related to your specific application.
InTEGRATED® Solder Preforms are compatible with most reflow methods such as: I/R, Laser, Vapor Phase, Conduction, Convection or Hot-Air Guns.
Standard packaging consists of rigid-board folders in argon-filled poly bags. Custom packaging is available upon request.
The shelf life of solder preforms is dependent on the alloy composition. Pb-free alloys, and alloys with lead content of less than 70%, have a shelf life of 1-year from the date of manufacture (DOM). Alloys with lead content >70% have a shelf life of 6-months from the DOM.
