Available Metals and Alloys
Pure indium, tin, lead and silver, or any combination thereof, can be made into InTEGRATED® Solder Preform. Upon request, other metals and alloys will be evaluated for their applicability to InTEGRATED® Solder Preform technology.
Array Pitch Tolerance - Non-Accumulative
Center to center accuracy can be held to +/-.0002".
Physical Dimensions
Because specification limitations vary by alloy, preform thickness and shape, and other considerations, please consult with our sales or technical staff for recommendations related to your specific application.
Reflow Methods
InTEGRATED® Solder Preforms are compatible with most reflow methods such as: I/R, Laser, Vapor Phase, Conduction, Convection or Hot-Air Guns.
Packaging
Standard packaging consists of rigid-board folders in argon-filled poly bags. Custom packaging is available upon request.
Shelf Life
The shelf life of solder preforms is dependent on the alloy composition. Pb-free alloys, and alloys with lead content of less than 70%, have a shelf life of 1-year from the date of manufacture (DOM). Alloys with lead content >70% have a shelf life of 6-months from the DOM.