INDIUM CORPORATION Indium Pop Flux 23Lv Package-On-Package

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PoP Flux 23LV is a thixotropic no-clean flux designed for package-on-package dipping applications with Pb-free solders. PoP Flux 23LV has a rheology designed to be sufficient to hold packages in place before and during reflow, yet allows the correct amount of flux to adhere to the spheres, over an extended pot-life.

Features

  • Rheology optimized for dipping and package-holding
  • Holds packages up to 25mm x 25mm in outline
  • Long pot life/working life
  • Excellent solderability with Cu-OSP and AuNi finishes
  • Optimized for Pb-free (SAC alloy) applications
  • Clear, non-brittle residue
  • Air reflow
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Package-on-Package (PoP) assembly is most commonly carried out by printing solder paste onto the substrate and placing the logic chip into the paste. The memory package is then either dipped into a specially-designed PoP flux or solder paste and placed on top of the logic chip. The whole assembly is then reflowed. No-clean processes are used.

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