The Nikon Metrology XT V130 X-ray Inspection System is a high-precision, flexible solution that facilitates defect analysis in loaded PCB boards. Designed for 100% BGA and µBGA inspection, multi-layer board inspection and PCB solder joint inspection, it is a compact, easy-to-use, and most of all, cost-effective inspection system that is an indispensable workhorse in any electronics production area.
- In-house micro-focus source with 3-micron focal spot size
- Change position, angle and zoom as desired
- 4-inch image intensifier, optically coupled to a digital CCD camera
- Large set of 16-bit image processing tools
- True 60° tilting angle for easy inspection of internal features