Application Range
Crimp cross-sectional analysis has quickly become an integral part of the crimp quality process. With the MicroGraph System (MGS), crimp cross-sectional images can be created in a fraction of the time compared to conventional methods.
The combined sawing-polishing process, innovative electrolyte staining process, and high precision optics result in high quality images for thorough analysis of the connection. Electrical connections (e.g. crimped, welded, soldered or spliced) can be cut (sawed), polished, stained (cleaned), and visually analyzed.
The system includes modular components that can be combined according to individual needs. Ergonomically designed work tables are also available to optimize workflow when combining the components in one area. The complete system can also be integrated into mobile carts to create a mobile quality station.
Technical Data
| Dimensions (L x W x H) |
Optional Work Table (without components)
1107 x 768 x 951 mm (43.6 x 30.2 x 37.4")
Optional Mobile Cart (without components)
600 x 600 x 1200 mm (23.6 x 23.6 x 47.2")
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| CE-Conformity |
The MicroGraph System fully complies with all CE and EMC equipment guidelines relative to mechanical and electrical safety and electromagnetic compatibility.
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